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Aditya Kumar

Aditya Kumar

GlobalFoundries - New York / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 5050642
person_outline Aditya Kumar's MOST POPULAR ARTICLES
1-) Study of 15µm pitch solder microbumps for 3D IC integration Electronic Components and Technology Conference, 2009. ECTC 2009. 59th, 6-10, 2009
2-) Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5 Ag solder and electroless Ni–P metallization on Cu substrate Thin Solid Films 504 (1), 410-415, 2006
3-) Fabrication of high aspect ratio TSV and assembly with fine-pitch low-cost solder microbump for Si interposer technology with high-density interconnects Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011
4-) Wafer level embedding technology for 3D wafer level embedded package Proceedings of the 59th electronic components and technology conference …, 2009
5-) Solutions strategies for die shift problem in wafer level compression molding Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011