Chunjian (Charles) Ni

Lenovo Group - Singapore / Hong Kong

Engineering & Technology / Mechanical Engineering

AD Scientific Index ID: 4965559

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Chunjian (Charles) Ni's MOST POPULAR ARTICLES

1-) Review of multiscale simulation in submicron heat transfer International Journal for Multiscale Computational Engineering 3 (1), 2005

2-) User-serviceable liquid DIMM cooling system US Patent 8,638,559, 2014

3-) Liquid-cooling memory modules with liquid flow pipes between memory module sockets US Patent 8,587,943, 2013

4-) Coupled electro-thermal simulation of MOSFETs International Electronic Packaging Technical Conference and Exhibition 43598 …, 2009

5-) Parallel computation of the phonon Boltzmann transport equation Numerical Heat Transfer, Part B: Fundamentals 55 (6), 435-456, 2009

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