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Harsh Pandey

Harsh Pandey

Alexander von Humboldt Foundation - Maharashtra / India
Others
AD Scientific Index ID: 4881497
अलेक्जेंडर वॉन हम्बोल्ट फाउंडेशन
person_outline Harsh Pandey's MOST POPULAR ARTICLES
1-) Formation of high aspect ratio through-glass vias by the combination of ultrasonic micromachining and copper electroplating Journal of Manufacturing Processes 82, 569-584, 2022
2-) Ultrasonic-assisted surface roughening of glass substrate to improve adhesion of electroless nickel seed layer in microsystems packaging Materials Letters 316, 132033, 2022
3-) Continuous electroless seed layer deposition in through-glass-vias by ultrasonic agitation IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024
4-) Localized surface roughening to improve adhesion of electroless seed layer in through-glass vias Materials Science in Semiconductor Processing 183, 108757, 2024
5-) Investigations into velocity decay, initial tool-workpiece gap, and material removal behaviour in ultrasonic micromachining Journal of Manufacturing Processes 124, 52-67, 2024