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Hui Wang Cui

Hui Wang Cui

Osaka University - Suita / Japan
Engineering & Technology / Nanoscience and Nanotechnology
AD Scientific Index ID: 352714
大阪大学
person_outline Hui Wang Cui's MOST POPULAR ARTICLES
1-) Super Flexible, Highly Conductive Electrical Compositor Hybridized from Polyvinyl Alcohol and Silver Nano Wires RSC Advances 5 (10), 7200-7207, 2015
2-) Highly Stretchable, Electrically Conductive Textiles Fabricated from Silver Nanowires and Cupro Fabrics Using a Simple Dipping-Drying Method
3-) Ultra-fast photonic curing of electrically conductive adhesives fabricated from vinyl ester resin and silver micro-flakes for printed electronics Rsc Advances 4 (31), 15914-15922, 2014
4-) High performance electrically conductive adhesives from functional epoxy, micron silver flakes, micron silver spheres and acidified single wall carbon nanotube for electronic … International Journal of Adhesion and Adhesives 44, 220-225, 2013
5-) Electrical and mechanical properties of electrically conductive adhesives from epoxy, micro-silver flakes, and nano-hexagonal boron nitride particles after humid and thermal aging International Journal of Adhesion and Adhesives 44, 232-236, 2013