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Jiebin Gu

Jiebin Gu

Shanghai Institute of Microsystem and Information Technology - Shanghai / China
Others
AD Scientific Index ID: 4815739
上海微系统和信息技术研究所
person_outline Jiebin Gu's MOST POPULAR ARTICLES
1-) Through-glass-via based microstrip band-pass filters fabricated with wafer-level low-melting-point alloy micro-casting IEEE Electron Device Letters 41 (7), 1106-1109, 2020
2-) A novel capillary-effect-based solder pump structure and its potential application for through-wafer interconnection Journal of Micromechanics and Microengineering 19 (7), 074005, 2009
3-) Study of a through-silicon/substrate via filling method based on the combinative effect of capillary action and liquid bridge rupture Journal of Micromechanics and Microengineering 26 (7), 075009, 2016
4-) An optimized through-via bottom-up method for simultaneous-filling TSVS of different aspect-ratios and its potential application on high-frequency passive interposer Microelectronics Journal 101, 104798, 2020
5-) Solder pump technology for through-silicon via fabrication Journal of microelectromechanical systems 20 (3), 561-563, 2011