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Peter Ze Zhu

Peter Ze Zhu

City University of Hong Kong - Kowloon / Hong Kong
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4578052
person_outline Peter Ze Zhu's MOST POPULAR ARTICLES
1-) Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0. 3Ag0. 7Cu-CNTs solder Materials Science and Engineering: A 727, 160-169, 2018
2-) Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing Microelectronics Reliability 91, 179-182, 2018
3-) Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods Journal of Materials Science: Materials in Electronics, 2016
4-) Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect Microelectronics Reliability 92, 12-19, 2019
5-) Reliability of wearable electronics—Case of water proof tests on smartwatch 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-5, 2017