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Ping Chuan Wang

Ping Chuan Wang

State University of New York at New Paltz - New Paltz / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 1670945
person_outline Ping Chuan Wang's MOST POPULAR ARTICLES
1-) Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction Applied Physics Letters 72 (11), 1296-1298, 1998
2-) Metal adhesion by induced surface roughness US Patent 8,039,314, 2011
3-) Electromigration threshold in copper interconnects Applied Physics Letters 78 (23), 3598-3600, 2001
4-) Foundation of RF CMOS and SiGe BiCMOS technologies IBM Journal of Research and Development 47 (2.3), 101-138, 2003
5-) Process of enclosing via for improved reliability in dual damascene interconnects US Patent 6,383,920, 2002