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Pradeep Dixit

Pradeep Dixit

Indian Institute of Technology Bombay - Mumbai / India
Others
AD Scientific Index ID: 516352
भारतीय प्रौद्योगिकी संस्थान, मुंबई
person_outline Pradeep Dixit's MOST POPULAR ARTICLES
1-) Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV) 2009 59th Electronic components and technology conference, 624-629, 2009
2-) Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating Journal of the Electrochemical society 153 (6), G552, 2006
3-) Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins Applied physics letters 90 (3), 2007
4-) Fabrication of multiple through-holes in non-conductive materials by electrochemical discharge machining for RF MEMS packaging Journal of Materials Processing Technology 271, 542-553, 2019
5-) Effect of tool electrode roughness on the geometric characteristics of through-holes formed by ECDM Precision Engineering 60, 437-447, 2019