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Qiming Zhang

Qiming Zhang

Hong Kong University of Science & Technology - Kowloon / Hong Kong
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 5395924
香港科技大學
person_outline Qiming Zhang's MOST POPULAR ARTICLES
1-) Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays 2013 IEEE 63rd Electronic Components and Technology Conference, 1788-1793, 2013
2-) 3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing Journal of Micromechanics and Microengineering 27 (4), 045012, 2017
3-) Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
4-) Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering 2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
5-) Development of innovative cold pin pull test method for solder pad crater evaluation 2012 14th International Conference on Electronic Materials and Packaging …, 2012