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Saipeng Li

Saipeng Li

Southeast University - Nanjing / China
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4883473
东南大学
person_outline Saipeng Li's MOST POPULAR ARTICLES
1-) Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7 Cu-xIn lead-free solder alloy Journal of Alloys and Compounds 742, 835-843, 2018
2-) Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn–0.7 Cu solder joints Journal of Materials Science: Materials in Electronics 28 (21), 16120-16132, 2017
3-) Jet printing morphology and rheological characteristics of silver paste electrically conductive adhesives (ECAs) 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017
4-) Rheological characterization and jet printing performance of Sn–58Bi solder pastes Journal of Materials Science: Materials in Electronics 29 (6), 4575-4582, 2018
5-) The effect of conductive filler on the properties of Electrically Conductive Adhesives (ECAs) 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017