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Tae-Kyu Lee

Tae-Kyu Lee

Cisco Systems - - / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 4400586
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person_outline Tae-Kyu Lee's MOST POPULAR ARTICLES
1-) Effect of inclusion size on the nucleation of acicular ferrite in welds ISIJ international 40 (12), 1260-1268, 2000
2-) Fundamentals of lead-free solder interconnect technology Springer (US) chapter 1, 1-20, 2015
3-) The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints Journal of Electronic Materials 41 (2), 283-301, 2012
4-) Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: Surface finish effects Journal of Electronic Materials 39 (12), 2564-2573, 2010
5-) Sn-Ag-Cu solder joint microstructure and orientation evolution as a function of position and thermal cycles in ball grid arrays using orientation imaging microscopy Journal of electronic materials 39 (12), 2588-2597, 2010