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Tingyu Bai

Tingyu Bai

University of California Los Angeles - Los Angeles / United States
Engineering & Technology / Metallurgical & Materials Engineering
AD Scientific Index ID: 1769995
University of California
person_outline Tingyu Bai's MOST POPULAR ARTICLES
1-) Experimental observation of high intrinsic thermal conductivity of AlN Physical Review Materials 4 (4), 044602, 2020
2-) Low thermal boundary resistance interfaces for GaN-on-diamond devices ACS applied materials & interfaces 10 (28), 24302-24309, 2018
3-) Direct visualization of thermal conductivity suppression due to enhanced phonon scattering near individual grain boundaries Nano letters 18 (6), 3466-3472, 2018
4-) Integration of polycrystalline Ga2O3 on diamond for thermal management Applied Physics Letters 116 (6), 2020
5-) Heterogeneous integration at fine pitch (≤ 10 µm) using thermal compression bonding 2017 IEEE 67th electronic components and technology conference (ECTC), 1276-1284, 2017