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Yanwei Dai

Yanwei Dai

Beijing University of Technology - Beijing / China
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 4502308
北京工业大学
person_outline Yanwei Dai's MOST POPULAR ARTICLES
1-) Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process Current Applied Physics 19 (5), 570-581, 2019
2-) A lifetime prediction method for IGBT modules considering the self-accelerating effect of bond wire damage IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (2 …, 2020
3-) Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload International Journal of Fatigue 162, 106943, 2022
4-) On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters Materials Science and Engineering A, 2021
5-) Vibration lifetime estimation of PBGA solder joints using Steinberg model Microelectronics Reliability 102, 113474, 2019