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Yuanming Chen

Yuanming Chen

University of Electronic Science & Technology of China - Chengdu / China
Engineering & Technology / Electrical & Electronic Engineering
AD Scientific Index ID: 679096
电子科技大学
person_outline Yuanming Chen's MOST POPULAR ARTICLES
1-) Plating uniformity of bottom-up copper pillars and patterns for IC substrates with additive-assisted electrodeposition Electrochimica Acta 120, 293-301, 2014
2-) A comparison of typical additives for copper electroplating based on theoretical computation Computational Materials Science 147, 95-102, 2018
3-) Computational analysis and experimental evidence of two typical levelers for acid copper electroplating Electrochimica Acta 273, 318-326, 2018
4-) Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole Electrochimica Acta 283, 560-567, 2018
5-) Label‐free diagnosis for colorectal cancer through coffee ring‐assisted surface‐enhanced Raman spectroscopy on blood serum Journal of Biophotonics 13 (4), e201960176, 2020